CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

National Institute of Standards and Technology

Funding

Varies

About

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

Eligibility

An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Applicant types

Grants.gov eligibility code 25

Visit Official Funding Page →

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Notice-specific evidence check

What an applicant must verify for CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

Applicant evidence

Applicant type: Other eligible applicants

Opportunity boundaries

Recorded deadline: November 2, 2026; confirm time zone and submission system.
Recorded focus: Science, technology and research

Do not infer missing fields: geographic eligibility, award amount. Absence from this directory record is not evidence that a restriction does not exist.

Before investing in an application, connect every eligibility claim, required registration, submission component and deadline to the current official notice. Open the recorded official source →

Application checklist

How to apply for CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

The steps below turn the recorded grant fields into a pre-submission check. They do not replace the current Notice of Funding Opportunity or its amendments.

Recorded eligibility

• Applicant types: Grants.gov eligibility code 25.
• Geographic scope is not structured in this record.
• Notice summary: An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Focus areas: ST

Recorded deadline

November 1, 2026 — confirm the time zone and submission system

A missing or rolling date is not permission to assume an open application window.

1. Confirm fitMatch your applicant type, location, project scope and any cost-share or registration rule to the official notice.
2. Read the noticeCollect the current guidelines, amendments, budget rules, required attachments and submission instructions.
3. Check timingRecord the deadline time zone, internal review date and any earlier registration or portal cut-off.
4. Submit thereUse the official application route and save the confirmation or submission reference.

Official sources

Recorded source: https://www.grants.gov/xml-extract

Open official notice →

Last directory verification: Sep 13, 2026.

CHIPS Incentives Program &#8211; Facilities for Semiconductor Materials and Manufacturing Equipment